In a decisive move to reshape the domestic landscape of electronic components manufacturing, the Department of Defense has allocated $269 million under the CHIPS Act, marking a pivotal moment in U.S. industrial policy.
The intersection of artificial intelligence (AI) and microelectronics is revolutionizing the technological landscape, driving significant advancements in both fields.
In the ever-evolving world of microelectronics, advanced packaging technologies are making significant strides, with glass core substrates emerging as a groundbreaking innovation.
In a dynamic push to bolster national security and technological prowess, the U.S. Department of Defense (DoD) has embarked on a groundbreaking initiative: the Microelectronics Commons Hubs Tour.
n an age where technological advancement shapes the very fabric of national security, the modernization of defense microelectronics has emerged as a paramount priority.
Microelectronics have fundamentally transformed modern military technology, providing the foundation for advanced communication systems, precision-guided munitions, unmanned systems, and cybersecurity measures.
Electronic components are the essential building blocks of all modern electronic devices, each playing a specific role in ensuring the functionality and performance of electronic systems.