The semiconductor industry is witnessing a paradigm shift as manufacturers increasingly turn to heterogeneous integration to overcome the limitations of traditional device scaling.
As the demand for smaller, faster, and more efficient devices grows, traditional packaging methods are being replaced by cutting-edge techniques that offer significant improvements in performance and reliability.
In the ever-evolving world of microelectronics, advanced packaging technologies are making significant strides, with glass core substrates emerging as a groundbreaking innovation.