In 2025, the release of the MAPT Roadmap 2.0 by the Semiconductor Research Corporation (SRC) marks a pivotal moment for the microelectronics industry.
Sonoran Electronics
The market for advanced semiconductor packaging is fast emerging as one of the most critical and dynamic segments in the microelectronics supply chain.
As transistors have shrunk and compute performance has skyrocketed, one stubborn bottleneck has remained: interconnects.
The rise of generative artificial intelligence is not limited to content creation and chatbots—it is now firmly entering the fabric of microelectronics design.
In an era where microelectronic components underpin critical infrastructure, defense systems, and consumer devices, the integrity of integrated circuits (ICs) is under increasing threat.
The 2025 IEEE International Electron Devices Meeting (IEDM), held in December in San Francisco, once again affirmed its place as the premier venue for unveiling next-generation semiconductor technologies.
In 2025, high-bandwidth memory (HBM) has surged to the forefront of microelectronics innovation, quickly becoming a critical enabler of AI performance.
In early 2025, speculation surfaced about a potential merger between Taiwan-based United Microelectronics Corporation (UMC) and U.S.-based GlobalFoundries, a move that could shake up the global semiconductor landscape.
In an age defined by digital computation, artificial intelligence, and software-defined everything, it’s easy to overlook the quiet resilience of analog microelectronics.
Modern microelectronics are marvels of precision engineering, containing billions of transistors packed into areas smaller than a fingernail. Yet few outside the semiconductor industry truly understand how these chips are made.
As commercial and governmental interest in space exploration and satellite infrastructure accelerates, the demand for microelectronic components that can survive—and thrive—in the harsh conditions of space has never been greater.
As global data volumes surge, driven by artificial intelligence, cloud computing, and streaming media, traditional electronic interconnects are approaching their physical and economic limits. In response, photonic microelectronics—a hybrid field that merges optical communication with semiconductor microfabrication—is emerging as a vital solution for high-speed, low-latency data transmission.