The semiconductor industry, long associated with rapid innovation and technological advancement, is increasingly being scrutinized for its environmental impact.
The escalating demands of artificial intelligence workloads, particularly those involving large-scale model training and real-time inference, have placed unprecedented stress on memory systems within computing architectures.
As Moore’s Law approaches its physical and economic limits, the semiconductor industry is increasingly turning to chiplet-based architectures as a scalable alternative to traditional monolithic integration.
In recent years, the global supply chain for electronic components has faced unprecedented disruptions, ranging from geopolitical tensions to natural disasters.
The semiconductor industry is witnessing a paradigm shift as manufacturers increasingly turn to heterogeneous integration to overcome the limitations of traditional device scaling.
In a robust display of regional commitment to advancing technological innovation, the Northeast Microelectronics Coalition (NEMC) Hub recently announced grant awards exceeding one million dollars.
In a decisive move to reshape the domestic landscape of electronic components manufacturing, the Department of Defense has allocated $269 million under the CHIPS Act, marking a pivotal moment in U.S. industrial policy.
The convergence of artificial intelligence (AI) and edge computing is reshaping the design and functionality of electronic components, enabling smarter and more autonomous systems.
Altermagnetism, a recently discovered magnetic phenomenon, is emerging as a groundbreaking advancement with the potential to revolutionize electronic devices.
The rollout of 5G networks represents a transformative leap in telecommunications, enabling faster data speeds, reduced latency, and enhanced connectivity.