he global microelectronics industry is once again confronted with how fragile deeply entangled supply chains have become.
2025 is shaping up to be a milestone year for quantum computing — and this has meaningful implications for the broader microelectronics industry, especially suppliers, packaging houses, and manufacturers who provide the foundational chips and substrates.
In 2025, the microelectronics industry is witnessing a major shift toward wide‑bandgap (WBG) semiconductors — especially Silicon Carbide (SiC) and Gallium Nitride (GaN) — as demand accelerates for high‑efficiency power devices, EVs, renewable‑energy systems, and high‑frequency telecommunications infrastructure.
The past few months have seen growing tension in global memory supply — with demand surging and supply struggling to catch up
In 2025 the microelectronics industry finds itself at a pivotal juncture as sweeping tariff threats and export control dynamics begin to reshape global supply chains in real time. For companies sourcing chips, components, and packaging, the evolving trade‑policy landscape is no longer a background risk, but a central operational factor.
Recent actions by the United…
A significant shift is underway in semiconductor manufacturing: equipment for panel‑level packaging (PLP) is seeing rapid growth as manufacturers look to meet performance, cost, and throughput demands of next‑generation microelectronics.
The recent decision by Nexperia to halt shipments to its Chinese manufacturing facility has sent a sharp warning through global microelectronics supply chains.
In 2025, the release of the MAPT Roadmap 2.0 by the Semiconductor Research Corporation (SRC) marks a pivotal moment for the microelectronics industry.
The market for advanced semiconductor packaging is fast emerging as one of the most critical and dynamic segments in the microelectronics supply chain.
As transistors have shrunk and compute performance has skyrocketed, one stubborn bottleneck has remained: interconnects.
The rise of generative artificial intelligence is not limited to content creation and chatbots—it is now firmly entering the fabric of microelectronics design.
In an era where microelectronic components underpin critical infrastructure, defense systems, and consumer devices, the integrity of integrated circuits (ICs) is under increasing threat.