In late 2025, sources close to SK hynix revealed plans for a significant expansion of semiconductor packaging capabilities in the United States. The South Korean memory giant is reportedly preparing to establish its first mass‑production 2.5D packaging facility in West Lafayette, Indiana, with a targeted opening in late 2028 and an estimated capital investment of US $3.87 billion.…
In late 2025, a lesser‑known but rapidly growing Chinese semiconductor firm has begun capturing global attention: ChangXin Memory Technologies (CXMT). Once a relatively small player in DRAM manufacturing, CXMT is now signaling a broader competitive shift as it ramps both capacity and technological capability in memory — an area long dominated by giants such as…
As 2025 draws to a close, a growing structural imbalance in the semiconductor memory market is beginning to influence multiple high‑volume industries. Leading DRAM manufacturers — including Samsung, SK Hynix, and Micron — are increasingly prioritizing production capacity for high‑bandwidth memory (HBM) and server‑oriented DRAM to meet surging demand from artificial‑intelligence (AI) data centers and large‑scale…
In December 2025, India’s semiconductor industry continued to gain strategic traction, reflecting a broader global shift toward diversified manufacturing, design, and supply chains. Multiple developments point to India’s transition from a predominantly design and R&D hub to an increasingly important player in semiconductor fabrication, packaging, and equipment investment — with implications for suppliers, buyers, and global…
In late December 2025, Taiwan Semiconductor Manufacturing Company (TSMC) reported robust financial results that underscore its central role in the global microelectronics supply chain. For the month of December 2025 alone, TSMC’s consolidated revenue reached approximately NT$335 billion (~US $10.6 billion) — up 20.4 percent year‑over‑year even as revenues eased slightly from November’s levels. For the full calendar year, the company’s…
he global microelectronics industry is once again confronted with how fragile deeply entangled supply chains have become.
2025 is shaping up to be a milestone year for quantum computing — and this has meaningful implications for the broader microelectronics industry, especially suppliers, packaging houses, and manufacturers who provide the foundational chips and substrates.
In 2025, the microelectronics industry is witnessing a major shift toward wide‑bandgap (WBG) semiconductors — especially Silicon Carbide (SiC) and Gallium Nitride (GaN) — as demand accelerates for high‑efficiency power devices, EVs, renewable‑energy systems, and high‑frequency telecommunications infrastructure.
The past few months have seen growing tension in global memory supply — with demand surging and supply struggling to catch up
In 2025 the microelectronics industry finds itself at a pivotal juncture as sweeping tariff threats and export control dynamics begin to reshape global supply chains in real time. For companies sourcing chips, components, and packaging, the evolving trade‑policy landscape is no longer a background risk, but a central operational factor.
Recent actions by the United…
A significant shift is underway in semiconductor manufacturing: equipment for panel‑level packaging (PLP) is seeing rapid growth as manufacturers look to meet performance, cost, and throughput demands of next‑generation microelectronics.
The recent decision by Nexperia to halt shipments to its Chinese manufacturing facility has sent a sharp warning through global microelectronics supply chains.